Silicone thermal pad-Heat conductive tapes-HUNGTECH GRUOP

【Heat conductive tapes】Silicone thermal pad

Release date:2016/6/8 12:19:59Origin: HUNGTECHViews：

● Product Introduction:

silicone thermal pad is high-performance, thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment, and heat sink or product outer coving. With nice stickiness, flexibility, good compression performance and excellent heat conductivity, it make the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.

● Features & benefits:

High reliability & High thermal conductivity

High compressibility, soft and flexible

Natural stickiness, no extra surface frontal adhesives

Meet with the environmental requirements of ROHS and UL

● Typical Application:

Communication equipment，Mobile equipment，LED Light ，Video equipment，Switching power supply，Networking equipment，Back light model，Household appliances，Medical equipment，PC server/workstations

The filling between PCB and heat sink

The filling between IC and heat sink or product outer coving

The filling between IC and similar heatsink cooling materials

● Technicial Properties:

Property	NF100	NF150	NF200	NF300	NF500	NF600	Test method
Thickness（mm)	0.3-10MM	0.3-10MM	0.3-10MM	0.3-10MM	0.3-10MM	0.3-10MM	ASTM D374
Composition	Silicon& ceramics						——
Color	White	White	White	Blue	Blue	Blue	Visuai
Hardness shoreC	30±5	30±5	30±5	30±5	30±5	30±5	ASTM D2240
Density g/cm3	2.2	2.2	2.2	2.2	2.2	2.2	ASTM D792
Tear strengthKN/m	0.2	0.80	0.80	0.80	0.70	0.70	ASTM D412
Elongation %	100	132	135	134	143	146	ASTM D374
Temperature ℃	-40—220	-40—220	-40—220	-40—220	-40—220	-40—220	EN344
Breakdown voltage Kv	3.0	4.0	5.0	＞10	＞10	＞10	ASTM D149
Volume resistivity Ω·cm	1.5×10¹⁶	1.5×10¹⁶	1.5×10¹⁶	1.5×10¹⁶	1.5×10¹⁶	1.5×10¹⁶	ASTM D257
Permittivity @1MHz	3.5	4.51	4.51	4.51	4.51	4.51	ASTM D150
Weight Loss %	＜0.5	＜0.5	＜0.5	＜0.5	＜0.5	＜0.5	@200℃240H
Fireproof class	V—0	V—0	V—0	V—0	V—0	V—0	UL 94
Thermal Conductivity W/m.k	1.0	1.5	2.0	3.0	5.0	6.0	ASTM D5470