Pure film products on surface roughness, surface has better submissive and adhesion, and has high temperature resistance, moisture resistance, resistance to solvent type etc. characteristics. 3M also offers a double side release paper version,

Model

Description

467MP

Model:467MP
Thickness:0.05
Features and Applications:Good resistance to thermal shock, all kinds of plastic / metal shell and foam with excellent adhesive properties. Suitable for bonding / nameplate signs, microphone and mesh filter bonding, metal / polyester cover adhesive, adhesive and other components.

468MP

Model:468MP
Thickness:0.125
Features and Applications:Thicker version of 467MP. Stripping of higher strength, good resistance to thermal shock, all kinds of plastic / metal shell and foam with excellent adhesive properties. Suitable for bonding / nameplate signs, microphone and mesh filter bonding, metal / polyester cover adhesive, adhesive components.

966

Model:966
Thickness:0.05
Features and Applications:Good resistance to thermal shock, all kinds of plastic / metal shell and foam with excellent adhesive properties. Suitable for general high temperature reflow process, such as: the reinforcement of flexible line.

7955MP

Model:7955MP
Thickness:0.125
Features and Applications:468MP double release paper version.

9079

Model:9079
Thickness:0.05
Features and Applications:Excellent heat resistance and impact resistance, low volatility, can be used for high temperature lead-free process, its off type paper can also be reflow soldering. For example: the bonding of flexible circuit board (high temperature reflow soldering).

9082

Model:9082
Thickness:0.05
Features and Applications:Especially excellent high temperature resistance, low release gas. To meet the demanding requirements of the production and operation at high temperature, can be used for high temperature lead-free process, its off type paper can also be reflow soldering. Such as: the bonding of flexible circuit board (high temperature reflow soldering).

9085

Model:9085
Thickness:0.125
Features and Applications:9082 thicker version, especially excellent high temperature resistance, to meet the demanding requirements of production and operation at high temperature. Can be used for high temperature lead-free process, its off type paper can also be reflow soldering. For example: the bonding of flexible circuit board (high temperature reflow soldering) 。

9458

Model:9458
Thickness:0.025
Features and Applications:Super thin, high initial viscosity. Flexible circuit board can be used for fixing the reflow process.

9471LE

Model:9471LE
Thickness:0.05
Features and Applications:Particularly suitable for bonding to the surface of the powder coating, low surface energy of the plastic and oily materials.

9472LE

Model:9472LE
Thickness:0.13
Features and Applications:9471LE's thickened version is particularly applicable to the bonding of powder coatings and the low surface energy of the rough plastic.

9482PC

Model:9482PC
Thickness:0.05
Features and Applications:The higher the initial viscosity and shear force, good viscosity on plastic and foam.

9485PC

Model:9485PC
Thickness:0.125
Features and Applications:Thicker version of 9482PC.

9671LE

Model:9671LE
Thickness:0.05
Features and Applications:9471LE thick release paper version, the flatness is better, more convenient to operate.

9672LE

Model:9672LE
Thickness:0.13
Features and Applications:9472LE thick off type board, the flatness is better, more convenient to operate.

F9460

Model:F9460
Thickness:0.05
Features and Applications:Good heat resistance, high bonding strength, high shear strength, and excellent waterproof performance. Can be used for high temperature lead-free reflow soldering process, such as: flexible circuit board reinforcement, or a request frame adhesive, such as the heat resistance

F9469

Model:F9469
Thickness:0.13
Features and Applications:Good heat resistance, high bonding strength, high shear strength, and excellent waterproof performance. Can be used for high temperature lead-free reflow soldering process, such as: flexible circuit board reinforcement, or a request frame adhesive, such as the heat resistance.

F9473

Model:F9473
Thickness:0.25
Features and Applications:Better bonding strength than F9469, good heat shock, high shear strength, and excellent waterproof performance. Can be used for high temperature lead-free reflow soldering process, such as: flexible circuit board reinforcement, or a request frame adhesive, such as the heat resistance.